In January, the upcoming Xiaomi Civi 3 was rumored to be equipped with the Dimensity 8200 chipset. Xiaomi has confirmed that the Civi 3 will be powered by the Dimensity 8200 Ultra chipset, which is a special variant of the Dimensity 8200.

The brand has yet to reveal details about this particular chip. In terms of context, the Dimensity 8200 has eight cores, one Cortex-A78 core clocked up to 3.1 GHz, three Cortex-A78 core clocked up to 2.85 GHz, and four Cortex-A55 core clocked up to 2.0 GHz. . It also has Mali-G610 MC6 GPU. The Dimensity 8200 supports 5G connectivity with speeds up to 17 Gbps. It also supports Wi-Fi 6E and Bluetooth 5.3.

Earlier reports had mentioned that the upcoming Civi 3 smartphone is expected to feature a 6.55-inch OLED display with curved edges reminiscent of its predecessor, the Civi 2. On the front, users can expect dual 32-megapixel selfie cameras. On the back of the device will be a primary camera from the Sony IMX800 series, known for its outstanding imaging capabilities.

With the Dimensity 8200-Ultra chipset, the Civi 3 is likely to offer impressive performance and efficiency. It is expected to have ample storage, including up to 12GB of RAM and 512GB of internal storage. Fast charging enthusiasts will be happy to hear the rumor that the phone supports 67W fast charging, making it quick and convenient to top up the battery.

A recent post on Weibo revealed that the Civi 3 will have a special edition in collaboration with Disney, adding uniqueness and charm to the smartphone lineup.