As The Wall Street Journal notes, the tendency for iPhone 15 series smartphones to overheat when using fast charging and working with resource-intensive programs is becoming increasingly large-scale. Anomalies began to be reported en masse by ordinary users, so experts do not exclude that Apple will have to programmatically limit the performance of the same processor to prevent overheating of the device.

According to the publication, the technical support service is still trying to reassure owners of the iPhone 15 Pro and iPhone 15 Pro Max that the high heating during the operation of the smartphone is due to the intensity of use of hardware resources during the initial setup and configuration of the device. software and status should return to normal. But not all new buyers are ready to accept these arguments. Experiments conducted by WSJ representatives showed that the iPhone 15 Pro Max can heat a separate part of the case to 44 degrees Celsius while simultaneously charging and running games. By the way, in this regard it was not much ahead of its predecessor, the iPhone 14 Pro Max, which was tested in a similar scenario.

Well-known industry analyst Ming-Chi Kuo said that one of the reasons why the iPhone 15 Pro and iPhone 15 Pro Max are overheating could be their new titanium frame. First, titanium itself has poor thermal conductivity. Secondly, it is a fairly light metal, which also worsens the thermodynamics of the smartphone. However, it should be noted that only the outer frame of Apple’s new flagships is made of titanium, while the jumpers inside the case are made of aluminum. According to some reviewers, smartphones of this series heated up to 50 degrees Celsius during intense work. In fact, iFixit representatives compared Apple’s activities in this field to the story of Icarus, which got too close to the sun and burned its wings as a result.

Chinese users of the iPhone 15 Pro even experienced problems when trying to communicate in messengers and charge their smartphone at the same time. The device refused to charge, citing its high temperature and need for cooling. According to sources, starting next year, Apple expects to switch to the use of printed circuit boards with a new composition that will improve the ability to dissipate heat while reducing thickness.

According to other sources, adding a physical SIM card slot to the iPhone’s design required some compromises in the layout, which worsened the heat dissipation conditions. According to Ming-Chi Kuo, the real way for Apple to limit the heating of new smartphones may be simply to limit the performance of the processor and some other components by software. Both scenarios (with and without overheating problems) pose risks for the company in terms of the success of the current generation of smartphones on the market.