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Famous analyst Ming-Chi Kuo shared new information that Apple will reduce the thickness of the motherboard by incorporating polymer-coated copper (RCC) components into the iPhone’s motherboard. “RCC will
Famous analyst Ming-Chi Kuo shared new information that Apple will reduce the thickness of the motherboard by incorporating polymer-coated copper (RCC) components into the iPhone’s motherboard.
“RCC will reduce the thickness of the motherboard, save internal space and make drilling easier due to the absence of fiberglass,” the analyst writes. “However, RCC will not be used in iPhone 16 2024 due to its fragile features and failure to pass the drop test.”
The rumor that Apple will start using RCC technology for the iPhone 16 appeared quite recently, but Ming-Chi Kuo claims that we will have to wait a few more years.
Ajinomoto is now a leading supplier of RCC materials. If Apple and Ajinomoto can develop the RCC material by the third quarter of 2024, it will be used in new high-end iPhone 17 models in 2025. Ming-Chi Kuo
The iPhone 17 series is expected to be released in September 2025.
Source: Port Altele
I’m Sandra Torres, a passionate journalist and content creator. My specialty lies in covering the latest gadgets, trends and tech news for Div Bracket. With over 5 years of experience as a professional writer, I have built up an impressive portfolio of published works that showcase my expertise in this field.
