Chips made using 2-nanometer technology are expected to enable more powerful and energy-efficient chips than we have today, as smaller transistor sizes lead to lower power consumption and higher performance. In addition, more of them can be physically placed in the same area, leading to an increase in strength. This is especially important for artificial intelligence training and the development of modern technologies such as mobile devices, computers and servers. The sector will achieve even better results with the next generation. But let’s start from the beginning.

2 nanometers

As it is known, TSMC has started the construction of two factories that can produce N2 chips and is waiting for approval from the government to establish the third. The company’s official representative, Mark Liu, told investors that it will start mass production of new chips in 2025.

• The first factory will be located next to the R1 research center, which was built for the development of N2 and new generation technologies. Large-scale production is expected to begin at this enterprise.
• The second facility will be located on the territory of the Southern Taiwan Science Park. According to estimates, the start of mass production at this facility will occur a little later, probably by the end of 2026. The capacities of both facilities have not yet been announced.
• They want to build the third one in Taichung Science Park. If TSMC can start construction of this facility in 2025, the facility will be put into operation as early as 2027.

1 nanometer

While smartphone manufacturers are lining up to get 2-nanometer processors into their devices as early as possible, TSMC is making the semiconductor race much more interesting as the world’s first foundry to start preparations for one-nanometer production.

This technical process has long been the dream of the entire technology world, it has even been called the “holy grail” in the field of semiconductors. TSMC will be the leader in this market, ahead of companies like Intel and Samsung.

The new facility will revolutionize the technology industry in terms of increased productivity and efficiency. At the IEDM conference, TSMC shared plans to develop a 1nm process by 2030, saying it would pack a whopping trillion transistors onto a single chip.

Taiwan Economic Daily reports that TSMC’s 1-nanometer plans will be too expensive because Estimated costs exceed one trillion won, or approximately US$32 billion.

The facility is expected to be built in southern Taiwan. The 100-hectare area will be split 60/40, allowing for the production of both semiconductors and packaging in the same facility.

It’s hard to say right now how good these processors will be, but it’s clear that they will surpass everything we have today.