According to reports, some iPhone 16 models will have thinner bezels thanks to Boundary Reduction Structure (BRS) technology Electric. BRS technology allows for a more compact and efficient arrangement of circuits beneath the display, resulting in thinner bezels without compromising display performance or the overall form factor of the device. This requires precision and advanced manufacturing techniques, given the difficulty of tighter circuit layout and the need to bend some wires towards the bottom of the panel.

Display Driver Integrated Circuits (DDIs), the components at the heart of this manufacturing challenge, control the activation and illumination of pixels on an OLED panel. To meet Apple’s demands, LG Display is apparently diversifying its DDI supply chain, adding Taiwan’s Novatech alongside its existing supplier LX Semicon. The move aims to strengthen quality control while reducing costs.

It’s unclear whether the thinner bezel technology is aimed at the standard ‌iPhone 16‌, iPhone 16 Pro and ‌iPhone 16 Pro‌ Max models, or both. It will most likely appear separately on the “iPhone 16 Pro” models, as the screen size of these devices is expected to increase from 6.1 to 6.3 inches and from 6.7 to 6.9 inches, without a significant increase in overall size. It is also worth noting that last year Apple made the iPhone 15 Pro and ‌iPhone 15 Pro‌ Max much smaller than the iPhone 15 and ‌iPhone 15‌ Plus. Last month, a report from Korea said that BIS technology would come to the entire “iPhone 16” series.