Overall, although the earthquake caused some disruption to the semiconductor industry, rapid recovery and preparedness measures helped mitigate its impact on production.

scales of destruction

• In the DRAM memory industry, Nanya’s Fab 3A factory in Xinbei and Micron’s factory in Taipei’s Linkou District were the worst affected. Nanya, which produces products based on 20-30nm processes, and Micron’s factory, which is vital for the production of DRAM with advanced technologies, are experiencing some difficulties. However, both companies are expected to be fully operational soon.
• TSMC, a leading semiconductor manufacturer, sustained minor equipment damage in the special Fab 12 factory 2 nm affected the technological process Production of microcircuits. While this resulted in temporary outages and potentially increased capital expenditures, the company’s other facilities quickly resumed operations with minimal impact.

Despite the earthquake, TSMC’s factories using advanced 3 nm and 5 nm process technologies, maintained high capacity utilization rates. These businesses were able to quickly resume operations, with more than 90% of production restored within a few hours of the seismic event.

Other semiconductor manufacturers such as UMC, PSMC, and Vanguard also reported minimal damage to their facilities. These companies quickly resumed production after conducting inspections and evacuating personnel.