in 2025 Apple Plans to launch a slimmer version of the iPhone that will be sold alongside the iPhone 17iPhone 17 Pro AndiPhone 17 Pro Max. According to Mark Gurman BloombergThis ‌iPhone 17‌ “Air” will be about two millimeters thinner than the current one iPhone 16 Pro.

iPhone 16 Pro It has a thickness of 8.25 mm, soiPhone 17If it is 2 mm thinner, the thickness will be approximately 6.25 mm. With a thickness of 6.25 mm, the ‌iPhone 17‌ Air will be Apple’s thinnest ‌iPhone to date. The thinnest iPhone we’ve seen was the iPhone 6, which is 6.9mm thick. iPhones have gotten thicker since the ‌iPhone‌ X and beyond, with Apple increasing the thickness to make more room for the battery, camera lenses, Face ID hardware and more.

Apple will equipiPhone 17‌ Air It has its own specially designed 5G modem chip, and this chip is smaller than Qualcomm’s 5G modem chips. Gurman says Apple focused on making the chip more integrated with other Apple-designed components to save space inside the “iPhone,” and saving space allowed it to create a smaller “iPhone 17” Air without sacrificing battery, camera or device performance. image quality.

Previous rumors also suggested that:iPhone 17‌ Air It will be somewhere between 5 and 6 mm thick, with ~6 mm thickness now being recommended by several reliable sources. The ‌iPhone 17‌ Air is expected to have a screen size of around 6.6 inches and also have a single-lens rear camera.

‌iPhone 17‌ Weather It will be one of three devices to receive Apple’s custom modem chip in 2025; Apple will also introduce the chip to the iPhone SE and low-cost iPad early in the year.

As Apple improves the design of the modem chip, the space gained could enable “new designs” such as a foldable “iPhone.” According to Gurman, Apple continues to research foldable “iPhone” technology. Apple plans to phase out Qualcomm modems within three years as it introduces increasingly powerful modem chips.

Eventually, Apple may release a system-on-chip that includes the processor, modem, Wi-Fi chip and other parts, which would save additional space and allow for tighter integration between hardware components.