On March 21, OPPO will launch the highly anticipated Find X6 series. The Find X6 Pro is expected to be the main attraction of the event as the leaked images show an impressive camera module design that is quite recognizable. The Find X6 Pro’s camera module has an “Oreo” shaped design with three cameras and an LED flash. The upper part of the case is made of glossy coated glass, and the lower part is made of pure metal with a matte finish. This design choice is likely to improve recognition and set the OPPO Find X6 Pro apart from other smartphones on the market.

The partnership between OPPO and Swedish camera manufacturer Hasselblad is also evident from the logo engraved in the middle of the camera module. The OPPO Find X6 Pro will also be powered by a MariSilicon X chip, which will further improve the device’s camera performance.

According to blogger “Digital Chat Station”, the Find X6 Pro will feature a triple Sony IMX989+IMX890+IMX890 camera unit on the back panel. All of these sensors are 50 megapixels. On the front, the Find X6 Pro will have a 32-megapixel Sony IMX709.

The OPPO Find X6 Pro will also feature a Snapdragon 8 Gen2 processor and is expected to score over 1.20 million AnTuTu points, making it a high-performance device. Under the hood, the device is expected to pack a 5,000mAh battery that supports 100W wired and 50W wireless fast charging. In addition to the Find X6 Pro, OPPO will also launch the Find X6 and OPPO Pad 2, which will be powered by the latest MediaTek Dimensity 9200 chipset and the OPPO Enco Free3 wireless earphones.