MediaTek has quietly introduced its newest processor, the Dimensity 7050. The new chipset will be launched in the upcoming Realme 11 series smartphones and the Realme 11 Pro+ model recently spotted on Geekbench features Dimensity 7050 and 12GB of RAM.

MediaTek is effectively rebranding its existing Dimensity 700, 800 and 900 series SoCs to the new Dimensity 6000 and 7000 series. The move aims to simplify the company’s product portfolio and provide a more transparent naming system for consumers. The core technology and features remain largely unchanged. MediaTek Dimensity 7050 is a rebranded version of Dimensity 1080.

Features of MediaTek Dimensity 7050:

The Dimensity 7050 SoC is manufactured using TSMC’s advanced 6 nm process and its CPU consists of two high-performance 2.6 GHz Cortex-A78 cores and six energy-efficient 2.0 GHz Cortex-A55 cores. The graphics processor is equipped with Mali-G68 MC4, which supports LPDDR5/4x memory and UFS 3.1/2.1 data storage standards.

As for the display specifications, the chipset can handle displays with a resolution of 2520 x 1080 pixels and a refresh rate of 120 Hz. Camera support is also impressive, with lenses up to 200 MP, 4K HDR video recording and advanced features like hardware HDR video, triple HDR-ISP and MENR.

On the video front, the Dimensity 7050 offers encoding support for HEVC and H.264 formats, as well as playback compatibility with HEVC, H.264, MPEG-1/2/4 and VP-9 codecs.

Devices powered by the Dimensity 7050 chipset are expected to provide a significant increase in gaming performance. MediaTek has integrated features such as Wi-Fi Rapid Channel, 5G HSR mode specially designed for gaming, and super hotspot power saving technology to provide a smooth gaming experience for users. In addition, the processor supports global navigation satellite systems (GNSS) and the latest Wi-Fi 6 standard, further enhancing its capabilities and compatibility.