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Redmi K70 shown in a render: three rear cameras and ultra-thin corners

  • July 11, 2023
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This morning the Chinese blogger “Fixed Focus Digital” published the first Image of the alleged Redmi K70Confirm the design of the camera module by anticipating a schizzo. Redmi

Redmi K70 shown in a render: three rear cameras and ultra-thin corners

This morning the Chinese blogger “Fixed Focus Digital” published the first Image of the alleged Redmi K70Confirm the design of the camera module by anticipating a schizzo.

Redmi K70 shown in a render: three rear cameras and ultra-thin corners

Later, the Redmi K70 will have three cameras to distribute a matrix laterSimilar to the Mi 13 standard introduced at the end of 2022. The main difference is that the Mi 13 has the “LEICA” logo on the bottom right, while the Redmi K70 has the flash.

Redmi K70 will also have a display con cornici molto sottili e uniformi water tutti e quattro i latiguarantees che dovrebbe un’ottima esperienza visiva. Naturally, these renders could not faithfully represent the final product.

In all quantitative performance, the secondary uncertainty is to equip the Redmi K70 with lo Snapdragon 8 Generation 2Qualcomm’s chip chip in 2023. The processor has a 4 nm TSMC processor and a CPU of 1+4+3 architecture. The strongest core Cortex X3 is 3.2 GHz, followed by 4 large cores (2 Cortex-A715 and 2 Cortex A710) at 2.8 GHz and 3-core Piccoli Cortex A510 at 2 GHz. Snapdragon 8 Gen2 also supports LPDDR5x memory at 4200 MHz and UFS 4.0 standard.

Redmi K60 Pro Redmi K60 Ultra Redmi K70 Pro
Redmi K60 Pro

Snapdragon 8 Gen2 also stands out with its cognitive ISP, which allows it to automatically improve photos and videos thanks to real-time semantic segmentation. L’ISP frees your imagination of volti, tratti del viso, capelli, vestiti, cielo and other elements and optimizes separation with artificial intelligence.

province Redmi K70 proinvece, sarà ancora più potente, grazie allo Snapdragon 8 Gen 3Qualcomm’s next-generation mobile platform. This chip comes with a 1+3+4 architecture CPU, 3.5GHz super-large Cortex X3 core, 3GHz big Cortex A715 3-core and 2GHz 4-core piccoli Cortex A510. Snapdragon 8 Gen3 will also support LPDDR5x memory and UFS 4.1 standard at 4800 MHz.

I own a smartphone of the Xiaomi sub-brand dovrebe essere presents entro la fine dell’anno.

Source: T Today

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