In a groundbreaking announcement, MediaTek and TSMC announced their successful collaboration to develop MediaTek’s first 3nm chip using TSMC’s advanced technology. This partnership marks an important milestone in the longstanding relationship between these two tech giants that promise to revolutionize the world of semiconductor manufacturing.

MediaTek, a global leader in semiconductor solutions, is preparing to introduce its flagship system-on-chip (SoC) Dimensity, which is scheduled to go into mass production next year. This initiative underlines the companies’ commitment to leverage their strengths in chip design and manufacturing to jointly create flagship systems on a superior performance and energy efficient processor that will ultimately improve the user experience across a wide range of global devices.

MediaTek president Joe Chen expressed his commitment to using the latest technology to create products that positively impact our lives. TSMC’s unwavering commitment to high quality manufacturing allows MediaTek to showcase its superior chip design, providing high performance and quality solutions to customers worldwide, especially in the competitive flagship market.

TSMC’s senior vice president of sales for Europe and Asia, Dr. Cliff Howe emphasized that this collaboration expands the reach of advanced semiconductor technology and makes it accessible to everyday devices such as smartphones. The partnership between MediaTek and TSMC has brought many innovations over the years and they are excited to continue pushing the boundaries of the 3nm generation and beyond.

TSMC’s 3nm process is at the center of this success, offering significant improvements in performance, power efficiency and performance over previous N5 processes. Developed by MediaTek, SoC Dimensity can reach up to 18% faster speed with the same power consumption as TSMC’s 3nm technology, or up to 32% lower power consumption at the same speed. In addition, this technology provides an impressive 60% increase in logic density, paving the way for more powerful and efficient devices.

MediaTek’s Dimensity processor-based systems, built using this cutting-edge technology, are designed to meet the ever-increasing demands of today’s users. These operating systems are designed to deliver a seamless and immersive user experience with superior performance in mobile computing, high-speed connectivity, artificial intelligence and multimedia.

Leveraging the power of TSMC’s 3nm process, the first flagship chipset will be called Dimensity 9400 and is expected to launch in the second half of 2024. It will power a wide variety of devices including smartphones, tablets, smart cars and more, and will set new standards for performance and efficiency in the tech industry. Source