Intel is working on 3D cache technology to counter AMD’s 3D V-cache, but the result is not yet available.

Intel CEO Pat Gelsinger says Intel isn’t blind to the success of AMD’s chips with 3D V-Cache on board. In a general question-and-answer session during the Intel Innovate event earlier this week, Gelsinger said they are working on a different approach to 3D stacked cache. He also emphasizes that the technology will not be in Meteor Lake yet. He won’t say which one.

Before giving further explanations, he emphasizes that the 3D V-Cache technology does not come from AMD, but from chip manufacturer TSMC. A subtle dig at Team Red, even if they benefit from it.

“In our roadmap we see the idea of ​​a 3D chip as a cache on one The and beyond that, the CPU part with our Foveros 3D technology, which makes its debut in Meteor Lake.”

Develop your own 3D architecture

He says in Question Time that Intel is in good shape when it comes to new technologies around next-generation memory architecture packaging and 3D stacking. “You can do that even as a small child The in a processor or wholesale for AI applications and servers that require high performance.”

Theoretically, Intel, like AMD, can adopt TSMC’s 3D V-Cache, but prefers to develop its own solution. “It has been on the long-term horizon of our plans for many years,” concludes Gelsinger.

AMD is already having great success with its Ryzen X3D CPUs, which perform well beyond expectations in certain situations such as gaming or rendering. Within the Epyc server range, Genoa-X also uses TSMC’s 3D V-Cache.

Intel showed a lot of news at its Innovate event. For example, the Meteor Lake “Intel Core Ultra” chips will be available on the market from December 14th and the successor is already showing: Lunar Lake. In between, Intel also showed off the new 288-core Sierra Forest Xeon processor, which will be available next year, and is testing a new production method for making chips out of glass.