In collaboration with Submer, Intel has found an immersion cooling method that can cool CPUs with up to 1,000 watts.

Founded in 2015, Submer focuses specifically on immersion cooling to keep servers fresh, among other things. It is a complement to air cooling and the rapidly emerging water cooling. You can read our background story here.

As components become faster and consume more energy, heat generation increases. Water cooling is now a common solution for high-end devices, but Intel is also looking to make immersion cooling more widespread in collaboration with Submer. Therefore, a Forced Convection Heat Sink (FCHS) was developed together with them.

The new technology is not being discussed in detail by either company for the time being. In a demo, Intel manages to keep a CPU that consumes more than 800 watts, presumably the new Xeon chip Sapphire Rapids, cool. According to Submer, thanks to the liquid bath, the new solution can keep CPUs cool with up to 1,000 watts via passive cooling.

Submer claims that FCHS is not only very efficient, but can also be manufactured inexpensively, with or without a 3D printer. They see this as an important technological breakthrough that paves the way to higher TDPs in future collaborations, even over 1,000 watts.