The Dimensity 9300 is a new chipset that MediaTek has developed to power high-end devices. The new flagship of the Chinese manufacturer promises improvements in all sections compared to the 9200, which until now led its catalog, in process performance, graphics, photographic capacity or in the capabilities of its APU in tasks that involve artificial intelligence.

MediaTek SoCs are widely used in mid-range and entry-level Android smartphones and tablets and offer excellent performance/price ratio, especially at the lower end of the price spectrum. But it also has a high-end solution, and the one in question aims to compete with the best developments for mobile devices, the Qualcomm Snapdragon 8 Gen 3 or the Apple A17 Pro.

Size 9300, features

The new flagship from MediaTek will be manufactured in TSMC’s state-of-the-art foundry technology and will use a design that the firm describes as ‘All Big Core’ with Cortex-X4 cores as the tip of the spear. It also improves the graphics subsystem and supports more advanced displays with the latest GPU designed by ARM.

Of course, chip for AI it has its role. MediaTek promises an eight-fold increase in speed and capabilities over the previous generation by supporting top large language models, including Meta Llama 2, Baichuan 2, Baidu AI LLM and more. This should help developers quickly and efficiently implement multimodal generative AI applications in text, images, and music.

Its photographic capacity has also been improved with a new image processor ISP low-energy and always-on HDR with a resolution of up to 4K at 60 frames per second, 4K movie mode at 30 FPS with bokeh tracking, 4K AI noise reduction (AI-NR) and AI processing on RAW photos and videos. It will support the new Ultra HDR format supported in Android 14. And all this while maintaining consumption, as the manufacturer promises.

We’ll leave you with the summary main specifications:

• Manufactured by TSMC in 4 nanometer processes.
• 8-core ARM CPU: 4 Arm Cortex-X4 with an operating speed of up to 3.25 GHz and four Cortex-A720 cores operating up to 2.0 GHz.
• Immortalis-G720 GPU, the top of the ARM line. Supports native WQHD resolution with refresh rate up to 180Hz and 4K up to 120Hz Supports dual active displays for foldable shapes.
• APU 790. MediaTek’s own chip, which the manufacturer integrates into the SoC and is intended for AI tasks.
• It supports 9600 Mbps LPDDR5T RAM, which is currently the highest speed available in mobile phones.
• 5G Connectivity: With integrated 5G R16 modem supporting 4CC-CA Sub-6 GHz and 8CC-CA mmWave with MediaTek UltraSave 3.0+ technology to improve energy efficiency.

And his performance? Test site Geekbench has released the first performance figures and they are really good. Tested on the Vivo x100, the Dimensity 9300 scored 2270 on single core and 7916 on multi-core. The multi-core performance is higher than Apple A17 Pro as well as Snapdragon 8 Gen 3.

The first smartphones with the Dimensity 9300 chipset will be available during Christmas 2023 and we will definitely see it on terminals from Honor, Realme, Xiaomi, Oppo, Vivo and others.