Well-known smartphone chip manufacturer MediaTek announced the launch data of its new processor Il today. MediaTek Dimension 8300. It is interested in the 5G chip, which promises high performance and low energy consumption.

Launch data of the new MediaTek Dimensity 8300 processor has been revealed

MediaTek Dimensity 8300 It will be presented at an online press conference on 21 November at 15:00 (local time)With the presence of some of the most important partners of the community such as Oppo, Vivo, Realme and Xiaomi. The processor is described as “Bingfeng Energy Efficiency, Super Evolution”, referring to the Chinese name of the city of Shenzhen, where MediaTek is headquartered.

MediaTek’s new chip will be the successor to the MediaTek Dimensity 8200, which was released last December and received excellent reviews from critics and consumers. The new chip will improve the performance and scalability of its predecessor thanks to higher core frequency and better memory management.

According to the information announced by Revengus, a former employee of MediaTek who shares information on social media, MediaTek Dimensity 8300 consists of Cortex X3 cores at 2.8 GHz, three Cortex A715 cores at 2.4 GHz and four 2.4 GHz Cortex A715 cores. It will have an architectural configuration that consists of: Cortex has A715 core clocked at 1.6GHz. The chip will also support Cortex A510 core with Mali G520 MC6 GPU at 850 MHz.

Dimensity 8300 will be equipped with an integrated modem that will support Uplink and Downlink bands up to 7.5 Gbps and 3 Gbps respectively. The chip will be able to support up to four rear cameras and two front cameras with a maximum resolution of 108 MP.

The “price” and launch data of MediaTek Dimensity 8300 have not been officially announced by the company yet. However, it is estimated that the chip will be released at the end of the year or early next year. Therefore, the processor will be one of the most powerful and efficient processors in the smartphone market with 5G connectivity.