Qualcomm recently officially launched the Snapdragon 7 Gen 3 mobile platform, which brings a number of improvements in performance and efficiency. Built on TSMC’s advanced 4-nanometer process, the new chipset features a redesigned CPU architecture with four large cores and four smaller cores.

The CPU configuration includes a powerful 2.63 GHz core, three 2.40 GHz cores and four 1.80 GHz cores, contributing to a 15% increase in CPU performance compared to the previous generation Snapdragon 7 Gen 1. Complementing this is the Adreno 720 GPU. It offers a platform that offers: An impressive 50% increase in GPU performance while reducing overall power consumption by 20%.

Gamers will appreciate the platform’s support for Super Definition Gaming, which improves power efficiency by up to 13% during intense gaming, as demonstrated by Honor of Kings’ 30-minute 120fps HD display.

The artificial intelligence capabilities of the Snapdragon 7 Gen 3 platform provide a significant increase of 90% in overall performance and 60% in energy efficiency. It promises a more robust artificial intelligence experience, especially by bringing INT4 sensitivity to the Snapdragon 7 series. In artificial intelligence facial recognition scenarios, the platform provides a 15% increase in accuracy even in situations such as wearing a mask.

In terms of imaging, the Snapdragon 7 Gen 3 features a triple ISP design similar to the Snapdragon 8 series. It supports up to 200-megapixel stills, AI pixel rebinding, AI noise reduction, computational HDR 4K capture, and Dolby and more. Vision and surround sound.

Connectivity is another highlight: the Snapdragon X63 5G modem supports Dual SIM Dual Pass-through DSDA for download speeds of up to 5Gbps. Cellular FastConnect 6700 offers Wi-Fi 6 and Wi-Fi 6E support, as well as Bluetooth 5.3 and LE Audio support for maximum download speeds of up to 2.9 Gbps.