MediaTek is renewing its lineup of mobile chipsets and has just announced the Dimensity 8300. A step below its flagship SoC, the Dimensity 9300 announced earlier this month, promises improvement in all sections compared to the previous series.

MediaTek is a major industrial semiconductor manufacturer. Along with Qualcomm, it is the largest producer of mobile chips for third-party manufacturers, and its developments are heavily used in hundreds of smartphones, tablets and wearable devices. And generally with a remarkable relationship between functions and costs, which allows for limited prices for the end customer.

Size 8300

MediaTek defines this solution as “cheaper version for premium phones”. To begin with, it will be produced in more efficient processes, with 4nm from TSMC foundry. The CPU has 8 cores, Cortex-A715 Prime with a frequency of up to 3.35 GHz; three large Cortex-A715 cores clocked at 3.0 GHz and four smaller Cortex-A510 cores clocked at 2.2 GHz for less performance-intensive tasks.

As for the GPU, it’s a Mali-G615 which, in addition to better graphics performance, will support better visual properties, screens with a refresh rate of 120 Hz at WQHD+ resolution (180 Hz in FHD), high dynamic range HDR10+ and decoding of AVI media at 4K. It also has a new neural processing unit, a AI APU 780integrated into the chipset and based on the same architecture as the high-end Dimensity 9300 NPU.

The manufacturer simply promises performance increase in all sections while maintaining consumption. General data (versus the 8200 series) is summarized in:

• 20% faster CPU and 30% improvement in energy efficiency.
• 60% faster GPU with 55% improvement in energy efficiency.
• 330% improvement in AI performance, double INT and FP16 calculation.

The new chip also provides support for faster memory and storage, LPDDR5X-8533 MHz RAM and UFS 4.0. The chip can handle cameras with sensors of up to 320 megapixels and 4K video at 60 fps. It goes without saying that it supports 5G broadband networks, Wi-Fi 6E and Bluetooth with the possibility of expansion up to version 5.4.

The Dimensity 8300 chipset will arrive at the end of the year from MediaTek partners, certainly mobile phones from HONOR, Realme, Xiaomi, Oppo, Vivo and others.