AMD played yesterday in probably one of the most important Computex 2022 official announcements The details are your expected future generation AMD Ryzen 7000 s processors ZEN 4 architecture, about which the company provided us with an interesting insight a few months ago. The very promising progress that has made us expect it to come on the market since then, as well as to reveal more details about the new AM5 platform.

Its key element is, of course, the chipsets that will accompany this new generation of chipsets X670E, X670 and B650which will be one of the parties directly responsible for the performance leap that the Ryzen 7000 will provide, a generation with which AMD intends to complicate Intel, which has hit Alder Lake on the table in a movement to consolidate with Raptor Lake.

Be that as it may, what worries us now are the new AMD chipsets for their Ryzen 7000 and the peculiarities of each. And the first thing is to clarify which market segment each option is targeting. The E, which is shown at the end of the X670E, comes from Extreme, which already clearly shows that we are facing the highest range for the most demanding users, interest in resorting to the most extreme overclocking possible. The X670 is currently focused on high-end equipment and the B650 will be the most popular choice in the family.

The first thing we can mention about the new AMD chipsets is the confirmation of two rumors from recent months. The first is that AMD applies a cut-off point here, so they are only compatible with DDR5. This is an opportunity that was speculated about at the time, even before the release of Alder Lake, although Intel took a more conservative position that could tighten with the advent of Raptor Lake.

The second confirmed rumor is that for two higher class chipsets, the X670E and X670, AMD opted for dual chiplet design. and for what? Does this have anything to do with the time when Intel split functions between the North Bridge and South Bridge drivers? That is, is it a step backwards in terms of developments towards SHP? No, nothing with it, this time the function of both chiplets is to duplicate the functions in order to increase the capabilities of the motherboard without generating bottlenecks.

The X670E and X670 chipsets have been designed with overclocking in mind, although it is not clear whether this will be possible to practice with the B650. To this end, the main innovation that comes from the hands of this new generation of AMD is EXPO technology, a technology similar to the one already offered by Intel with XMP and which will safely simplify memory overclocking. This, combined with the fact that we can only use DDR5 memory, shows great performance.

As for the differences between the two chipsets, we find them first and foremost on PCIe holder 5. For motherboards with the X670E chipset, we can find the possibility of its use for graphics and storage in all cases, for models with X670 PCIe 5 graphics support, it will depend on the choice of the motherboard manufacturer. It will therefore be a very important detail when choosing a motherboard with this chipset. As for the B650, it will only support PCIe 5 for storage, not graphics.

AMD has not yet revealed important details about the three chipsets, especially about the B650, which is the one for which we have the least data. This in itself tells us that AMD is primarily interested in focusing on more powerful systems, in the face of the confrontation with Intel that we have been talking about for several months and that we are really looking forward to ..

We know of two X670s to offer 24 PCIe 5 lanesuntil four RAM memory slotsuntil eight SATA channels at six gigabits per second and support via CrossfireX for mounting up to three graphics cards in parallel. We’ll know the rest of the details when the manufacturers start introducing their first motherboards that integrate these chipsets.

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