Intel company announced new plans for the development of advanced technical processes. Specifically, the company announced the 1.4nm Intel 14A process, which will be the world’s first chip manufacturing technology using ultra-hard ultraviolet light lithography with high numerical aperture (High-NA EUV). In addition, an addition to the previously presented plans for the launch of technical processes was announced.

The original plan of Intel CEO Pat Gelsinger (Pat Gelsinger), presented in 2022, which meant mastering five technical processes in four years, remains valid. Intel 7 and Intel 4 technologies are already on the market, and Intel 3 is ready for mass production. Development of Intel’s 20A (2nm) and 18A (1.8nm) processes is on schedule, even ahead of schedule. Company management expects Intel to regain leadership in advanced semiconductors with the launch of Intel 18A in 2025.

Intel has provided partners with chip design tools for the 18A process in PDK 0.9, and the final version of the PDK 1.0 tools will be released in April or May. Additionally, Intel has completed the design of its Xeon Clearwater Forest server processors, meaning they are actually production ready. Clearwater Forest will be the first large-scale chip produced according to the Intel 18A technical process.

Intel’s advanced process development plan includes the new Intel 14A as well as several proprietary versions of previously introduced processes. The company has yet to announce performance and density targets for the 14A, saying it doesn’t want to draw attention to rivals just yet. Intel’s 1.4nm chips are known to feature next-generation PowerVia (possibly Source-on-Contact) and RibbonFET GAA transistors. Intel is planning two variants of the 14A: the standard 14A and its improved version, the 14A-E; where the letter E stands for advanced abilities. This is part of Intel’s new approach to the likes of TSMC and Samsung to create various changes to extend the life cycles of existing technological processes.

Although Intel has not yet specified the exact dates, it is known that the 14A-E technical process will begin test production in 2027. Accordingly, it can be assumed that the 14A will appear at least in test form in 2026, and will go into mass production in 2027. Like other advanced Intel processes, the new 14A will be developed in Oregon and then distributed to other factories.

Note that according to unofficial data, TSMC will start using High-NA EUV only by 2030, significantly later than Intel. However, this does not mean that it will automatically fall behind in terms of technology. High-NA technology will not be cheap and according to industry reports it is not as efficient as dual-pattern Low-NA EUV technology. Intel is confident that the cost of chip production will meet its expectations, but it also states that it will adjust the strategy if necessary.

Intel will also expand the Intel 18A, Intel 3, Intel 7 and Intel 16 processes with new versions. Intel plans to release new technologies every two years and then support them with expansions every two years. Additional technical processes will be indicated by suffixes. The letter P will indicate a new version of the technology with improved performance. The T suffix will indicate processes equipped with TSV (Through-silicon via) connection support that can be used in 3D Foveros packaged systems. The E suffix will indicate special new features such as adjustable voltage range. Intel will also initiate PT technical processes where performance will be increased and TSV support will be implemented, and other combined solutions will probably appear later.

In the near future, Intel will also launch the Intel 12 process, which will be the result of production cooperation with UMC. It is also stated that Intel Foundry will produce chips based on mature 65 nm technology with the help of Tower Semiconductor. Both of these collaborations are key to Intel Foundry’s continued expansion and will enable the company to acquire more of the hardware and production capacity it is currently paid for, keeping them busy rather than idle.

It will offer Intel 20A and Intel 18A processors, GAA transistors and backside silicon wafer (BSPDN) power supply. Moreover, the last of the technologies will be implemented two years before TSMC, and Intel will surpass the Taiwanese manufacturer 1.5 years after implementing GAA. Of course, this does not mean the defeat of TSMC – Samsung implemented GAA earlier, but difficulties in mass production did not allow the advantage to be realized. But at least technologically, Intel will be ahead, which will be a good help in achieving its goals in the contract chip manufacturing market.

The most important for the company is the Intel 18A process. And the company has already collected four large orders for the production of chips based on this technology, and one of them involves a large down payment, which means there are a lot of chips. Even today, Microsoft announced that it will instruct Intel to manufacture its chips using the 1.8nm process. Additionally, Intel has been successful in introducing the Intel 16 and Intel 3 processes and has made major deals for chip packaging services.