As early as mid-2022, the South Korean company Samsung Electronics mastered the production of 3nm products with the use of a transistor structure with an ambient gate (GAA), ahead of all competitors, but it did not bring significant success. customers. Currently, Samsung plans to introduce 1.4nm lithography standards by 2027 and also start using power supply on the backside of the silicon wafer as part of the 2nm process.

This became known as a result of a speech by Samsung representatives at a relevant event, as noted by Bloomberg and Reuters. The company reminded its customers that it can simultaneously supply computing accelerators with HBM-type memory and carry out chip production and subsequent packaging. This combination of competencies alone will reduce the production cycle time by 20%.

According to Samsung’s estimates, the capacity of the semiconductor component market will increase to $778 billion by 2028, thanks to the proliferation of computing accelerators for artificial intelligence systems. During that period, Samsung directly expects to increase the number of customers ordering such products from it by five times compared to the current level, and the corresponding revenue by nine times. Samsung representatives share the views of OpenAI founder Sam Altman (Sam Altman) on the industry’s needs in production capacities for the launch of computing accelerators. According to him, dozens of new businesses for chip production will need to be established to meet the demand.

Samsung believes that gate-type transistors (GAAs) will play an increasingly important role in the production of complex chips using advanced technologies. The company plans to start mass production of second-generation 3nm chips in the second half of this year. The structure of GAA transistors will also be used in Samsung’s 2nm process.

At most then, the company will also offer power supply from the back side of the silicon wafer, but this will already be within the framework of the second generation of the 2nm technological process. By 2027, the production of chips using 1.4 nm technology will be mastered. According to TrendForce, in the first quarter of this year, Samsung’s share in the contract chip manufacturing services market decreased from 11.3% to 11%, respectively. Maintaining its market leadership, TSMC steadily increased its market share from 61.2% to 61.7%.