Samsung Electronics announced the start of mass production of the industry’s thinnest memory module LPDDR5XThe packaging height of this new product is 0.65mm, approximately 9% smaller than the previous generation product (0.71mm), and the thermal resistance is improved by 21.2%.

Memory module LPDDR5XIt is based on the 12nm LPDDR RAM introduced by Samsung Electronics. It has a dual-layer structure with 4 stacks per stack and is available in 12GB and 16GB versions.

The smallest height and better thermal resistance of the module can provide more space for ventilation in mobile devices, improve the overall heat dissipation effect of the device, and ultimately provide better performance in high-load productive AI applications.

Bae En-chol, vice president of memory product planning at Samsung Electronics, said: “Samsung’s LPDDR5X DRAM sets a new standard for high-performance AI solutions in devices, not only delivering the superior performance of LPDDR, but also providing advanced thermal management in an ultra-compact package. We are committed to continuous innovation, working closely with our customers to deliver solutions that meet the future needs of the LP DRAM market. In the future, Samsung Electronics plans to expand its ultra-thin LPDDR DRAM memory package to 24GB 6-stack modules and 32GB 8-stack modules.”.