xMEMS Labs introduces a 1mm fan that can be placed on the chip of electronics, enabling more efficient active cooling in thin electronic devices such as smartphones and tablets.

Overheating can be fatal for electronics. Cooling electronic devices is a challenge for manufacturers. There are active and passive cooling methods for electronics. A new fan that can be placed on the chip could represent a new breakthrough in active cooling.

Cooling on the chip

The fan was developed by xMEMS Labs, a company that primarily develops stereo drivers for audio devices. The company is now applying the same MEMS (micro-electromechanical systems) technology to the fan, which is known as Fan-on-a-chip is applied to the fan. With a thickness of just under 1 mm, the fan takes up hardly any additional space inside a device.

The fan regulates the air circulation to and from the processor. According to xMEMS, it can move up to 39 cubic centimeters of air per second at a pressure of 1,000 Pascal. Consumption is limited to 30 mW.

The company believes that the fan could be used in a wide range of device types, from smartphones to laptops to VR headsets. The fan is also water and dust resistant (IP58). This cooling system is particularly beneficial for “thin” electronic devices.

Since the same technology is used for the drivers, production could begin relatively quickly. XMEMS Labs does not have its own factory, but has its drivers produced by TSMC and Bosch.