The Belgian research center Imec cooperates with world leaders in chip manufacturing, so its leadership could represent the development path of the entire semiconductor industry for the next few years. According to him, by 2037 chip manufacturers will master the A2 process, and three years later it will be possible to break the 0.1 nm barrier.

If we continue with what is accepted TSMC The A2 technical process corresponds to the lithographic standard of 0.2 nm or 2 angstroms. Thus, if the predictions of Imec chairman Luc van den Hove come true, the semiconductor industry could break the 1 angstrom barrier by 2040. He made his statements at a technology forum in Taiwan, where his work was widely covered in the local media.

Next year, the semiconductor industry will start 2nm chip production, and under this technical process the structure of transistors will change from FinFET to nanosheets, and after the transition to the A7 technical process in 2027, the structure of CFET transistors will be introduced. According to the Imec representative, the introduction of chips using A14 technology will require a mandatory transition to the use of equipment with a high numerical aperture value (High-NA EUV).

For TSMC, the transition to High-NA EUV is almost certain. As will be recalled, the world’s largest contract chip manufacturer has repeatedly stated that it does not intend to use such equipment in the production of products based on A16 technology. The Taiwanese giant plans to develop it from the second half of 2026.