Schneider Electric has developed a new reference design optimized for high-density, liquid-cooled AI data centers. The design supports Nvidia Blackwell chips.

Schneider Electric introduces a new reference design specifically designed to support high-density, liquid-cooled AI clusters with up to 132 kW per rack. The design is optimized for Nvidia’s GB200 NVL72 architecture and Blackwell chips. Thanks to the integration of liquid cooling, the design provides solutions for the high density and heat generation inherent in servers with these integrated AI chips in hyperscale, colocation and enterprise data centers.

The reference design was developed in close collaboration with – how could it be otherwise – Nvidia. Schneider Electric began preaching the AI ​​gospel at its Innovation Summit earlier this year, according to Jensen Huang, and has since released a number of reference designs.

Liquid cooling

This design includes options for Liquid-to-liquid coolant distribution units (CDUs) and directly on the chip Liquid cooling. Liquid cooling can significantly reduce energy consumption in data centers while enabling high density. The company did not come to this conclusion alone: ​​other HPC and server specialists are also increasingly relying on cooling. In this context, Lenovo uses its self-developed Neptune water cooling system as a major advantage.

The reference design provides data centers with a validated architecture that can simplify planning and implementation. At the same time, according to Schneider Electric, the design contributes to the sustainability goals of organizations. With this reference design, Schneider Electric expands its portfolio of AI-focused data center solutions and responds to the growing need for energy-efficient infrastructure in the data center sector.