TSMC is making greater progress than expected in developing its 2nm baking process. The node would be ready for mass production before the end of 2025.

TSMC is currently tinkering with its 2nm node. This process is going more smoothly than expected. The test yields are already around 60 percent. TSMC expects the 2nm production line to be ready for mass production before the end of 2025. When the time comes, the production line will be the most advanced in the world.

TSMC says goodbye to 2 nm FinFETwhich still forms the basis of transistors for 3 nm production today. The technology is being replaced by the more complex one Nanosheet. This is more suitable for transistors on such a small scale, where unwanted quantum effects and the excessive wavelength of light are just some of the challenges.

Advanced chips

TSMC is already the most advanced microchip manufacturer in the world thanks to its 3nm process. This is used by chipmakers like AMD and Nvidia to bake their CPUs and GPUs. Compared to 3 nm, 2 nm is said to bring a speed gain of more than ten percent and an efficiency gain of more than 25 percent. Apple will likely be at the forefront of the process while TSMC increases capacity and expands to multiple factories.

The search for ever smaller transistors continues unabated. Transistor size has a major influence on the density, performance and especially power consumption of microchips. The advanced manufacturing techniques are therefore a necessary piece of the puzzle for chip designers like Nvidia and AMD, who rely on them to build their microchips.