Connectivity has become a key element of a large number of device typesand at Qualcomm, they are very, very aware of the importance of becoming a benchmark provider in this market. The chips responsible for these connections play a key role in the new connectivity model, whether it’s connected cars or thermometers capable of transmitting their data over a wireless connection.
So while we’re usually looking at Qualcomm when launching a new SoC, other announcements, such as these new Radio Frequency Front-End (RFFE) modules It is a very interesting development., because it shows us the connection options available for devices that choose to integrate it. When? Well, not too long, as these new modules are currently being tested and commercial facilities with new solutions are expected to be released in the second half of 2022.
And what do these new Qualcomm chipsets offer? Let’s remember that RFFE modules are used in conjunction with connection products and deviceswhether it’s also Qualcomm solutions such as its Qualcomm FastConnect 7800 Wi-Fi 7 / Bluetooth and Snapdragon 5G Modem-RF Systems, or third-party WiFi and Bluetooth solutions to complete the system needed to deploy the connection.
Recall that RFFE modules, such as those presented by Qualcomm today, are responsible for administration signals received as sent to the antennas of the device. Thanks to its function, the signal always adapts and amplifies as needed and transfers this responsibility to the modem.
With this Qualcomm proposal, manufacturers have decided to integrate it into their devices They will be able to offer state-of-the-art connectivity, both with 5G and WiFi 7still in development and whose debut, depending on who you ask, will take place during the second half of 2022 or during 2023. Its integration into any device, but especially the more expensive ones (such as cars), will ensure that your connectivity stays on place for some time.
“With new products from Qualcomm Technologies, we are expanding our RFFE leadership to the automotive and IoT industries, helping OEMs address their huge industrial challenges such as development costs and scalability.said Christian Block, senior vice president and general manager of RFFE, Qualcomm Germany.OEMs using our solution can design products with higher performance, longer battery life and faster time to market, which will ultimately accelerate the pace of innovation and provide a better experience for consumers.“.
More information: official statement
Source: Muy Computer
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