As the performance of smartphones increases, both their component manufacturers and their assemblersWe face a problem that is evolving at the same rate: heat. Although the designs of integrated and other components are always optimized to the maximum, there comes a time when, at least temporarily, no further progress can be made in this direction, and that is when it is time to focus on distraction systems.

Such is the case of Infinix, which according to what we can read in Fonearena, developed a “3D vapor cloud chamber«, which is used in devices, allows to reduce its temperature by about three degrees. For this purpose, the design of the steam chamber has been optimized to better adapt to the surface with which it is to be in contact. Thanks to the small protrusions (compared to the flat design of conventional steam chambers), the need to use heat-conducting paste is significantly reduced, thereby improving the efficiency of the dispersion system.

It may seem like a small detail, but by adding a protrusion to the front of the case The 3D vapor cloud chamber can almost touch the SoC, reducing its thermal resistance. This increases thermal conductivity, performance and heat dissipation by reducing the shield’s thermal resistance to the vapor chamber. Compared to 2D designs, the new 3D VCC not only reduces the temperature by three degrees, but is also able to dissipate heat 12.5% ​​faster.

According to the company, the concept was clear, but its development presented certain problems, because controlling the contents of the chamber is significantly more complicated than in a normal steam chamber. In order to ensure an optimal flow of water and steam and of course that the irregular surface of the 3D steam mist chamber always works at its maximum in terms of dispersion, it was decided to use a more sophisticated capillary structure, as well as to use techniques Advanced soldering functions that you will not find in other coolers of this type.

According to Infinix, this is just the beginning, now the company is looking at ways to further improve this design. You want the 3D VCCs to be thinner and have more bumps so they are it can also effectively cool other heat-generating components inside the device. If they achieve this, if they can bring vapor chamber heat dissipation technology to the critical components (in that sense) that make up a smartphone, we may be in for a very important advance.