Last week we were able to learn from AMD the first motherboards for the already approaching AMD Ryzen 7000 and now Now we can expand on the details of what GIGABYTE has prepared, within its AORUS family, for users who want to make the leap to the next generation of AMD. And from what we can see, the tech seems determined to make the most of the design that comes from the hands of the ZEN 4.

More specifically, GIGABYTE has released the spec sheets of its first four Ryzen 7000 boards, all based, as their names suggest, on on X670E (X670 Extreme) and X670 chipsets. Recall that AMD announced three families of chipsets for the Ryzen 7000, the two mentioned above and the B650. The latter will be aimed at mid-range and entry-level, so the boards detailed today are aimed, as you may have guessed, at the top-performing teams.

These are spectacles of each of the four announced models.

GIGABYTE X670E AORUS XTREME

• AMD AM5 socket
• 18+2+2 phase VRM
• Dual-channel DDR5: 4 SMD DIMMs supporting ECC/non-ECC unbuffered memory
• 4 PCIe 5.0 x4 M.2 connectors
• Fins-Array III and M.2 Thermal Guard III: ensure VRM power stability and 25110 PCIe 5.0 M.2 SSD performance
• EZ-Latch Plus: PCIe 5.0 x16 SMD slot and M.2 connectors with quick release and screwless design
• Hi-Fi Audio with DTS:X Ultra: ALC1220 CODEC and ESS SABER 9118 Hi-Fi DAC with ESSentialo USB DAC
• AQUANTIA 10GbE LAN and Wi-Fi 6E.
• Enhanced Connectivity: DP, HDMI, USB-C 10 Gbps, Dual USB-C 20 Gbps and upcoming GIGABYTE USB4 AIC support
• Q-Flash Plus – BIOS update without CPU, memory and graphics card.

More information: GIGABYTE.

GIGABYTE X670E AORUS MASTER

• AMD AM5 socket
• 16+2+2 phase VRM
• Dual-channel DDR5: 4 SMD DIMMs supporting ECC/non-ECC unbuffered memory
• +2 PCIe 5.0 x4 connectors and 2 PCIe 4.0 x4 M.2 connectors
• Fins-Array III and M.2 Thermal Guard III: ensure VRM power stability and 25110 PCIe 5.0 M.2 SSD performance
• EZ-Latch Plus: PCIe 5.0 x16 SMD slot and M.2 connectors with quick release and screwless design
• High fidelity sound with DTS:X Ultra: CODEC ALC1220
• Fast networks: 2.5GbE LAN and Wi-Fi 6E 802.11ax
• Enhanced Connectivity: DP, HDMI, USB-C with DP Alt Mode, Dual USB-C 20Gb/s upcoming GIGABYTE USB4 AIC support
• Q-Flash Plus – BIOS update without CPU, memory and graphics card.

More information: GIGABYTE.

GIGABYTE X670 AORUS ELITE AX

• AMD AM5 socket
• 16+2+2 phase VRM
• Dual-channel DDR5: 4 SMD DIMMs supporting ECC/non-ECC unbuffered memory
• 1 PCIe 5.0 x4 connector and 3 PCIe 4.0 x4 M.2 connectors
• Mega-Heatpipe and M.2 Thermal Guard: to ensure VRM power stability and 25110 PCIe 5.0 M.2 SSD performance
• EZ-Latch: PCIe x16 slot and M.2 connectors with quick release and screwless design
• 2.5GbE LAN and Wi-Fi 6E 802.11ax
• Enhanced Connectivity: HDMI, Dual USB-C 20Gb/s Upcoming GIGABYTE USB4 AIC Support
• Smart Fan 6: multiple temperature sensors, hybrid fan head with FAN STOP
• Q-Flash Plus – BIOS update without CPU, memory and graphics card.

More information: GIGABYTE.

GIGABYTE X670 AORUS PRO AX

• AMD AM5 socket
• 16+2+2 phase VRM
• Dual-channel DDR5: 4 SMD DIMMs supporting ECC/non-ECC unbuffered memory
• 1 PCIe 5.0 x4 connector and 3 PCIe 4.0 x4 M.2 connectors
• Mega-Heatpipe and M.2 Thermal Guard III: ensure VRM power stability and 25110 PCIe 5.0 M.2 SSD performance
• EZ-Latch Plus: PCIe 5.0 x4 M.2 connector with quick release and screwless design
• Fast networks: 2.5GbE LAN Wi-Fi 6E 802.11ax
• Enhanced Connectivity: HDMI, Dual USB-C 20Gb/s Upcoming GIGABYTE USB4 AIC Support
• Smart Fan 6 – Includes multiple temperature sensors, hybrid fan head with FAN STOP function and noise detection
• Q-Flash Plus – BIOS update without CPU, memory and graphics card.

More information: GIGABYTE.