May 3, 2025
Science

A new thermal material has been discovered to solve the heating problem of data centers

  • November 15, 2024
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Although cloud computing technologies and artificial intelligence tools are very popular today, artificial intelligence is technically neither a ghost nor is a cloud actually a cloud. We need


Although cloud computing technologies and artificial intelligence tools are very popular today, artificial intelligence is technically neither a ghost nor is a cloud actually a cloud. We need data centers for many of today’s IT services. data centers Very high-cost buildings consume so much energy that companies buy or install nuclear power plants, and have significant environmental impacts with the heat they emit.

Most data centers in use today use harsh and energy-consuming cooling systems, and the hardware that stores our information is entrusted to these systems. Energy consumption in data centers about 40% is used for cooling. A new material developed by scientists is a candidate to solve this problem.

13 percent more efficient

University of Texas in the US and China from Sichuan University The new material developed by researchers will be able to reduce energy consumption, which reaches 8 terawatts per hour, by 13 percent. Thermal Interface Material (TIM) This material is called an organic structure.

TIM increases the rate at which heat is removed from active electronic components. this excess heat transfer it to water or cooler. This allows excess heat to be removed from the system. This reduces the demand for active cooling systems. These systems include fans and liquid cooling systems.

In the tests performed TEAMWhile it offered better cooling and heat transfer than leading thermal pastes, it also managed to extract heat from every point of the system. TIM also has a heat pump 65 percent less allowed him to expend energy.

Research Nature NanotechnologyIt was published in .

Source: Web Tekno

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