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Qualcomm Snapdragon 6 Gen 3 officially announced

  • October 3, 2024
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Qualcomm I recently introduced a new one. chipset Snapdragon 6 Gen 3Announcement at Sordina Con il code SM6475-AB. The processor has the potential that smartphones can reach and

Qualcomm Snapdragon 6 Gen 3 officially announced

Qualcomm I recently introduced a new one. chipset Snapdragon 6 Gen 3Announcement at Sordina Con il code SM6475-AB. The processor has the potential that smartphones can reach and often develops better content. Snapdragon 6 Gen 3 was introduced along with Snapdragon 7s Gen 2 as a version that retained most of its main features.

Qualcomm Snapdragon 6 Gen 3 officially announced

First to be equipped is Snapdragon 6 Gen 3 Fully efficient 4-core Cortex-A78 and octa-core CPU clocked at 2.4 GHz and 4-core Cortex-A55 clocked at 1.8 GHz. Uses front GPUAdreno710There is a guarantee of good graphics from the front line to the destination. This chipset supports both LPDDR4x and LPDDR5 RAM, offering smartphone manufacturers² greater flexibility. It is also compatible with UFS 3.1 storage, which provides high read and write speeds compared to previous standards.

One of the main differences between the Snapdragon 6 Gen 3 and the Snapdragon 7s Gen 2 relates to the frequency of supported display updates. On 7s Gen 2, screen movement can be performed at FHD + and 144Hz resolution. 6th Gen 3 and running at 120Hz. This limitation may not be important for every use, given a technical difference with the chip.

Snapdragon 6 Gen 3 also supports a wide range of connectivity technologies, including: Wi-Fi 6E and Bluetooth 5.2It guarantees a stable and fast connection. Chipset can be moved to preserve photo capacity slim sensor a 200 MP I support 4K HDR video recording at 30fps. This is to present a frame on the front panel for a smartphone and thus offer a photo presentation.

Another interesting aspect of Snapdragon 6 Gen 3 is its support for advanced artificial intelligence technologies that can be used for activities such as activity monitoring and noise cancellation during calls. This chipset is manufactured with a 4-nanometer manufacturing process, which contributes to improved energy efficiency and overall performance.

Source: T Today

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