Intel has overcome a major milestone in the manufacture of quantum chips for a new era of high-performance computing. At Intel’s Gordon Moore Park research center in Hillsboro, Oregon, Intel Labs and Components Research has achieved the highest results in manufacturing silicon spin-qubit devices using extreme ultraviolet lithography (EUV). The company’s engineers have created highly homogeneous quantum chips that deliver 95% performance across an entire 300mm silicon wafer.

Testing the second-generation chip has sparked controversy about the company’s progress in quantum chip manufacturing. Intel’s new quantum devices were sampled using a Cryoprober operating at very low temperatures to maintain the stability of the qubits and allow them to be used for computing purposes. This time, 95% of the company’s chips were selected correctly. It is worth noting that earlier all the efforts of the company were limited to individual cases. Thus, EUV technology is now suitable and provides high performance for the fabrication of many quantum chips on a wafer. At the same time, Intel continues to work on quantum computers that can work stably at room temperature. The company understands that this is crucial to a promising industry.

After completing development of the second generation test chip, Intel will try to optimize this process based on progress made to target the next generation. The main challenge is to be able to manufacture quantum chips with millions of qubits, which are currently in the early stages of development.